개최목적 JPCA Show 2008 (제37회 전자 회로 산업전) / 2008 Microelectronics Show (제21회 최첨단 실장 기술·패키징전) / JISSO PROTEC 2008 (제9회실장프로세스테 크놀로지전)는 여러 전자·정보통신기기에 사용되는 전자 회로·전자 실장기술 및 재료·제조 기계·장치 그리고 공정자재에 관한 기술과 정보의 교류를 도모하며, 아울러 전자 회로·전자 실장업계 전체의 발전에 기여하는 목적으로 개최됩니다.
회기 2008년 6월 11일 (수) - 6월 13일 (금) 오전 10시 - 오후 5시 (6월 13일만 오후 4시까지)
회장 토쿄 빅사이트동 전시동 회의동
테마 Navigation for the NEXT
～Electronic Circuits and Packaging Technologies Exhibitions Creating Cutting-Edge Products～
는 다음의 전시회로 구성됩니다.
To promote effective exhibition, the show site will be structured by the following 6 Exhibition-classifications
1. Electronic Circuits EXPO 2008
Rigid-type PWBs, Build-up MLBs, Flexible Circuits, Flex-Rigid Circuits, Ceramic PWBs, Metal Core Printed Board, Embeded Passive Substrate, Rigid Module Board, TAB/COF, Ceramic Module Board, TCP, Applications Products used by FPCs (FPD Module, Drive Module, etc.),Base Material for Rigid-type Boards, Film/Tape Materials, Electronic Circuits related Publications, Information, Services, etc.
2. Electronic Circuits Process EXPO 2008
PWB Manufacturing Process Materials (Chemicals, Ink, Film, etc.) and Equipment, Fabrication related Equipment and Materials. Flexible Circuit Manufacturing Process Materials and Equipment, Fabrication related Equipment and Materilals, Special Die, Punching/Auto-cutter machines, Electronic Circuits Manufacturing Process Materials and Equipments.
3. DES (Design and manufacturing Engineering Solution) EXPO 2008
Application Soft Wear, Electronic Circuits Design, System Consultation Service, EMS/ODM Business, Communication Network Solution, Internet Solution, Multimedia System Solutions, CAE Tools (CAD/CAM/CIM), Product Design Technology, Hard Wear Design, Model Development System, Molding, Rapid Prototyping System, DES related Publications, Information, Services, etc.
4. MicroTEST (Testing/Inspection and Analysis Exhibition) 2008
Electronic Board & Electronic Circuits Testing/Inspection System, Image Controller/Recognition System, 3-D Measuring Equipment, Analyzers, Special Tools for Testing and Measuring/Inspection System, Test/Inspection Business, Sensing Imaging Technology, Virtual Reality Technology, etc.
5. 2008 Microelectronics Show (22nd Advanced Electronics Packaging Exhibition)
Application Products with High-density/High-frequency electronics packaging technologies, High-density Substrates/Interporzers, IC Packages, Electronic Components, Embedded Packaging Board, System-in-a-Package, Display Device/Optical Device, Materials related to Electronics Packaging, Lead-free Solder, Polymer for High-frequency, Bonding/Mounting/Dispenser/Paste Printing Machines, Equipment for manufacturing, Environmental Consideration technologies, Recycle System, Electronics Packaging (Jisso) related Publication, Information, Services, etc
6. JISSO PROTEC 2008 (10th Jisso Process Technology Exhibition)
Application Products with Electronic Components Mounting Machines and Related Equipment/Systems PCB Assembly and Related Equipment/Systems, Semiconductor Mounting Equipment/Systems, Inspection and Testing Equipment, Electronic Packaging Design Systems, Electronic Packaging Devices/Components and Related Materials, Electronic Manufacturing Device Packaging Materials, Electronic Packaging/Joint Systems, High Frequency Rces/Components and Materials, Environmental Related Equipment and components and Materials , Publications, etc
는 다음의 전시회로 구성됩니다.
